type product specification number bus-12-114 title page revision 1 of 8 d authorized by date duplex plated bergstik? ii headers s. fierro 13 mar. 06 classification unrestricted copyright fci form e-3334 rev e gs-01-001 1.0 objective this specification defines the per formance, test, quality, and reliabilit y requirements of duplex plated bergstik ? ii headers. 2.0 scope this specification is applicable to the terminati on characteristics of t he duplex plated bergstik ? ii headers. when mated with fci's mini pv ? terminals or other 0.025" pin compatible receptacles on 0.100" centerlines, this product pr ovides board to board, board to cable, board to discrete wire and board to flex interconnect capabilities in vertical one, two or three row configurations and right angle one and two row configurations. this product can be lead free and meets the requirements of the european union directive of restrictions for hazardous s ubstances (directive 2002/95/ec) 3.0 general this document is composed of the following sections: paragraph title 1.0 objective 2.0 scope 3.0 general 4.0 applicable documents 5.0 requirements 5.1 qualification 5.2 material 5.3 finish 5.4 design and construction 6.0 electrical characteristics 7.0 mechanical characteristics 8.0 environmental conditions 9.0 quality assurance provisions 9.1 equipment calibration 9.2 inspection conditions 9.3 sample quantity and description 9.4 acceptance 9.5 qualification testing 9.6 requalification testing chart i ir reflow profile table i qualification testing matrix pdm: rev:d released . status: printed: jan 04, 2007
type product specification number bus-12-114 title page revision 2 of 8 d authorized by date duplex plated bergstik? ii headers s. fierro 13 mar. 06 classification unrestricted copyright fci form e-3334 rev e gs-01-001 4.0 applicable documents 4.1 specifications 4.1.1 engineering drawings 4.1.2 process drawings 4.2 military standards 4.2.1 mil-std-202: test methods for electronic and electrical component parts. 4.2.2 mil-std-1344: test methods for electrical connectors 4.2.3 mil-g-45204: gold plating, electrodeposited 4.2.4 mil-p-45209: palladium plating, electrodeposited 4.2.5 mil-p-81728: plat ing, tin-lead, electrodeposited 4.3 federal specifications 4.3.1 qq-n-290 nickel plating (electrodeposited) 4.4 other standards/specifications 4.4.1 ul-94-v0: flammability 4.4.2 astm b-159: phosphor bronze wire 4.4.3 ansi/asqc m-1: americ an national standard for calibration systems 4.4.4 fci bus-19-002: solderab ility of plated materials or contacts 4.5 fci lab reports - supporting data 4.5.1 el-95-04-047 duplex header qualification 4.5.2 el-2005-06-012cr 5.0 requirements 5.1 qualification connectors furnished under this s pecification shall be capable of meeting the qualification test requirements specified herein. 5.2 material the material for each component s hall be as specified herein or equivalent. 5.2.1 pins : pins shall be phosphor bronze alloy uns c51000 drawn wire in accordance with astm b-159. 5.2.2 insulator : high temperature resin with a flame retardant rating of ul-94-v0. pdm: rev:d released . status: printed: jan 04, 2007
type product specification number bus-12-114 title page revision 3 of 8 d authorized by date duplex plated bergstik? ii headers s. fierro 13 mar. 06 classification unrestricted copyright fci form e-3334 rev e gs-01-001 5.3 finish the finish of the pins shall be as specified herein for the options as listed in the product drawings under consideration. 5.3.1 solder tails : 100 u" minimum thickness of 60/40 tin lead per mil-p-81728 over 50 u" nickel per qq-n- 290, class 2. or 100-150 u? thickness pure tin for lead free option over 50 u? nickel 5.3.2 contact area : as defined by product drawings, will be plat ed with the specified thickness of gold per mil-g-45204, type ii over 50 u" of nickel per qq-n-290, class 2. 5.3.3 all other areas will be plated with 50 u" of nickel per qq-n-290, class 2. 5.4 design and construction connectors shall be of the design, construction and physical dimens ions specified on the applicable product drawings. 6.0 electrical characteristics 6.1 insulation resistance - the insulation resistance of the unmat ed connector shall not be less than 5,000 megohms when measured in accordance with mil-std-202, method 302. the following details shall apply: a. test voltage: 500 v dc. b. electrification time: two minutes. c. points of measur ement: between adjacent pins. 6.2 dielectric withstanding voltage - there shall be no evidence of arc-ov er, insulation breakdown or excessive leakage current ( > 1 milliampere) when the unmated c onnector is tested in accordance with mil-std-1344, method 3001.1. the following details shall apply: a. test voltage: 1500 volts ( dc, rms or ac, 60 hz). b. test duration: 60 seconds. c. test condition: 1 (760 torr - sea level). d. points of measur ement: between adjacent pins. pdm: rev:d released . status: printed: jan 04, 2007
type product specification number bus-12-114 title page revision 4 of 8 d authorized by date duplex plated bergstik? ii headers s. fierro 13 mar. 06 classification unrestricted copyright fci form e-3334 rev e gs-01-001 7.0 mechanical characteristics 7.1 pin retention - individual pins shall withstand an axial l oad of 2.0 pounds minimum applied at a rate of 0.2 inches/minute without dislodging from the insulato r prior to soldering or heat exposure. reference mil-std-1344a, method 2007.1. 8.0 environmental conditions after exposure to the following environmental conditions in accordance with the specified test procedure and details, the product shall show no physical damage and shall meet the electrical requirements per paragraph 6.0 as specified in the table l test sequences. connec tors shall be unmated during exposure. 8.1 thermal shock - mil-std-202, method 107g. a. test condition: a ( 25, 1 hour cycles ). b. temperature range: -55 to +105 deg. celsius. c. time at each temperature: 30 minutes. d. transfer time - 5 minutes, maximum. 8.2 humidity, steady state - mil-std-202, method 103b. a. temperature: +40 deg. celsius. b. relative humidity: 95%. c. test condition: b (96 hours). 8.3 high temperature life - mil-std-202, method 108a. a. test temperature: 105 deg. celsius. b. test duration: 315 hours. 8.4 solderability - fci bus-19-002 & mil-std-202, method 208f. a. steam aging - 4 hours. b. contact areas evaluated s hall meet the method 208 requirements. 8.5 resistance to solder heat - mil-std-202, method 210b. a. test condition: e b. there shall be no evidence of physical damage. 8.6 ir reflow - test ir profile per chart i. there sha ll be no evidence of physical damage after reflow. a. peak temperature: 245 +/- 5 deg. celsius. b. for lead free peak temperature: 260oc +/ - 5oc (peak temperature). duration: 10 seconds pdm: rev:d released . status: printed: jan 04, 2007
type product specification number bus-12-114 title page revision 5 of 8 d authorized by date duplex plated bergstik? ii headers s. fierro 13 mar. 06 classification unrestricted copyright fci form e-3334 rev e gs-01-001 9.0 quality assurance provisions 9.1 equipment calibration - all test equipment and inspection facilities used in the performance of any test shall be maintained in a calibration system in a ccordance with iso 9001/9002 and ansi/asqc m-1. 9.2 inspection conditions - unless otherwise specified herein, a ll inspections shall be performed under the following ambient conditions: a. temperature: 25 +/- 5 degrees celsius b. relative humidity: 30 to 60% c. barometric pressure: local ambient 9.3 sample quantity and description 9.3.1 the qualification samples shall consist of nine of the largest size connectors of the particular type being tested. 9.4 acceptance 9.4.1 electrical and mechanical requirements placed on test samples as indicated in paragraphs 6.0 and 7.0 shall be established from test data using appropriate statistical techniques or shall otherwise be customer specified, and all samples tested in accor dance with this product spec ification shall meet the stated requirements. 9.4.2 failures attributed to equipment, test setup or oper ator error shall not dis qualify the product. if product failure occurs, corrective action shall be tak en and samples resubmitted for qualification. 9.5 qualification testing - qualification testi ng shall be performed on samples produced with equipment and procedures normally used in production. the test sequence shall be as shown in table i. 9.6 requalification testing - if any of the following conditi ons occur, the responsible product engineer shall initiate requalification testing consisting of all applicable parts of the qualification test matrix, table i. a. a significant design change is made to the existing pr oduct which impacts the product form, fit or function. examples of significant changes shall include, but not be limited to, changes in the plating material composition or thickness, contact force, contact surface geometry, insu lator design, contact base material, or contact lubrication requirements. b. a significant change is made to the manufacturing process which impacts the pr oduct form, fit or function. c. a significant event occurs during production or end us e requiring corrective action to be taken relative to the product design or manufacturing process. pdm: rev:d released . status: printed: jan 04, 2007
type product specification number bus-12-114 title page revision 6 of 8 d authorized by date duplex plated bergstik? ii headers s. fierro 13 mar. 06 classification unrestricted copyright fci form e-3334 rev e gs-01-001 pdm: rev:d released . status: printed: jan 04, 2007
type product specification number bus-12-114 title page revision 7 of 8 d authorized by date duplex plated bergstik? ii headers s. fierro 13 mar. 06 classification unrestricted copyright fci form e-3334 rev e gs-01-001 table i - qualification testing pdm: rev:d released . status: printed: jan 04, 2007
type product specification number bus-12-114 title page revision 8 of 8 d authorized by date duplex plated bergstik? ii headers s. fierro 13 mar. 06 classification unrestricted copyright fci form e-3334 rev e gs-01-001 revision record rev page description ec# date a all released for approval v50879 7/05/95 b 1, 2, 4, 5 updates v51388 11/01/95 c all revised format to be consistent with v01904 08/03/00 gs-01-001, and change berg, dupont, etc. references to fci. d 1 to 4 add lead free information m06-0161 4/25/06 pdm: rev:d released . status: printed: jan 04, 2007
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